Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163690 | 2-D interconnections for integrated circuits | Chia-Tien Wu, Tai-I Yang, Wei-Chen Chu | 2018-12-25 |
| 10147609 | Semiconductor epitaxy bordering isolation structure | Wen-Chin Chen, Cheng-Yi Wu, Yu-Hung Cheng, Ren-Hua Guo, Chin-Szu Lee | 2018-12-04 |
| 10020261 | Split rail structures located in adjacent metal layers | Chia-Tien Wu, Wei-Chen Chu | 2018-07-10 |