Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163690 | 2-D interconnections for integrated circuits | Chia-Tien Wu, Hsiang-Wei Liu, Tai-I Yang | 2018-12-25 |
| 10074607 | Semiconductor device structure with graphene layer | Tai-I Yang, Tien-I Bao, Tien-Lu Lin | 2018-09-11 |
| 10026647 | Multi-metal fill with self-align patterning | Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu | 2018-07-17 |
| 10020261 | Split rail structures located in adjacent metal layers | Chia-Tien Wu, Hsiang-Wei Liu | 2018-07-10 |