Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109582 | Advanced metal connection with metal cut | Chih-Liang Chen, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2018-10-23 |
| 10109519 | Method of semiconductor integrated circuit fabrication | Hsiang-Lun Kao, Tien-Lu Lin, Yung-Chih Wang | 2018-10-23 |
| 10103102 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Chia-Tien Wu, Tien-Lu Lin, Tien-I Bao | 2018-10-16 |
| 10049956 | Passivation structure and method of making the same | Hsuan-Hui Hung, Kun-Ming Huang, Ming-Yi Lin | 2018-08-14 |
| 10026647 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Chia-Tien Wu | 2018-07-17 |
| 9875967 | Interconnect structure with air-gaps | Tai-I Yang, Yung-Chih Wang, Tien-Lu Lin | 2018-01-23 |
| 9865539 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Chia-Tien Wu, Tien-Lu Lin, Tien-I Bao | 2018-01-09 |