Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10114434 | Heat dissipation module and electronic device | Wen-Neng Liao, Cheng-Wen Hsieh | 2018-10-30 |
| 10109519 | Method of semiconductor integrated circuit fabrication | Hsiang-Lun Kao, Tien-Lu Lin, Cheng-Chi Chuang | 2018-10-23 |
| 10032713 | Semiconductor device structure and method for forming the same | Carlos H. Diaz, Tien-Lu Lin | 2018-07-24 |
| 10006471 | Fan module and electronic device using the same | Cheng-Wen Hsieh, Kuang-Hua Lin, Cheng-Yu Cheng, Wen-Neng Liao | 2018-06-26 |
| 9875967 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin | 2018-01-23 |