Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109582 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +6 more | 2018-10-23 |
| 10109519 | Method of semiconductor integrated circuit fabrication | Hsiang-Lun Kao, Yung-Chih Wang, Cheng-Chi Chuang | 2018-10-23 |
| 10103102 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu, Tien-I Bao | 2018-10-16 |
| 10074607 | Semiconductor device structure with graphene layer | Tai-I Yang, Tien-I Bao, Wei-Chen Chu | 2018-09-11 |
| 10032713 | Semiconductor device structure and method for forming the same | Yung-Chih Wang, Carlos H. Diaz | 2018-07-24 |
| 10002826 | Semiconductor device structure with conductive pillar and conductive line and method for forming the same | Tai-I Yang, Yu-Chieh Liao, Tien-I Bao | 2018-06-19 |
| 9875967 | Interconnect structure with air-gaps | Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang | 2018-01-23 |
| 9865539 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Cheng-Chi Chuang, Chia-Tien Wu, Tien-I Bao | 2018-01-09 |