Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163690 | 2-D interconnections for integrated circuits | Hsiang-Wei Liu, Tai-I Yang, Wei-Chen Chu | 2018-12-25 |
| 10163654 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2018-12-25 |
| 10162930 | Method of adjusting metal line pitch | Wei-Cheng Lin, Kam-Tou Sio, Shih-Wei Peng, Hui-Ting Yang, Chih-Liang Chen +3 more | 2018-12-25 |
| 10109582 | Advanced metal connection with metal cut | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Charles Chew-Yuen Young, Hui-Ting Yang +6 more | 2018-10-23 |
| 10103102 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin, Tien-I Bao | 2018-10-16 |
| 10026647 | Multi-metal fill with self-align patterning | Wei-Chen Chu, Tai-I Yang, Cheng-Chi Chuang | 2018-07-17 |
| 10020261 | Split rail structures located in adjacent metal layers | Hsiang-Wei Liu, Wei-Chen Chu | 2018-07-10 |
| 9997404 | Method of forming an interconnect structure for a semiconductor device | Yung-Hsu Wu, Cheng-Hsiung Tsai, Yu-Sheng Chang, Chung-Ju Lee, Yung-Sung Yen +4 more | 2018-06-12 |
| 9865539 | Structure and formation method of semiconductor device structure | Jian-Hua Chen, Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin, Tien-I Bao | 2018-01-09 |