Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163738 | Structure and method for overlay marks | Hsien-Cheng Wang, Ming-Chang Wen, Yao-Ching Ku | 2018-12-25 |
| 10163654 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chia-Tien Wu, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2018-12-25 |
| 10146141 | Lithography process and system with enhanced overlay quality | Chi-Cheng Hung, Wei-Liang Lin, Yung-Sung Yen, Ru-Gun Liu, Tsai-Sheng Gau +6 more | 2018-12-04 |
| 10114291 | Grafting agent for forming spacer layer | Ya-Ling Cheng, Ching-Yu Chang, Chien-Chih Chen, Siao-Shan Wang, Wei-Liang Lin | 2018-10-30 |
| 10096522 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chih-Liang Chen, Charles Chew-Yuen Young, Jiann-Tyng Tzeng +4 more | 2018-10-09 |
| 10032639 | Methods for improved critical dimension uniformity in a semiconductor device fabrication process | Chi-Cheng Hung, De-Fang Chen, Wei-Liang Lin, Yu-Tien Shen | 2018-07-24 |
| 10007177 | Method to define multiple layer patterns using double exposures | Ming-Huei Weng, Ching-Yu Chang | 2018-06-26 |
| 9997404 | Method of forming an interconnect structure for a semiconductor device | Yung-Hsu Wu, Cheng-Hsiung Tsai, Yu-Sheng Chang, Chia-Tien Wu, Chung-Ju Lee +4 more | 2018-06-12 |
| 9991132 | Lithographic technique incorporating varied pattern materials | Chin-Yuan Tseng, Chi-Cheng Hung, De-Fang Chen, Ru-Gun Liu, Tsai-Sheng Gau +1 more | 2018-06-05 |
| 9984876 | Lithographic technique for feature cut by line-end shrink | Yung-Sung Yen, Ko-Bin Kao, Ken-Hsien Hsieh, Ru-Gun Liu | 2018-05-29 |
| 9911697 | Power strap structure for high performance and low current density | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chi-Yeh Yu, Jiann-Tyng Tzeng +6 more | 2018-03-06 |