Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134615 | Substrate support with improved RF return | Aravind Kamath, Jallepally Ravi, Tomoharu Matsushita, Yu Chang | 2018-11-20 |
| 10049919 | Semiconductor device including a target integrated circuit pattern | Chieh-Han Wu, Chung-Ju Lee, Ming-Feng Shieh, Ru-Gun Liu, Shau-Lin Shue +1 more | 2018-08-14 |
| 10014175 | Lithography using high selectivity spacers for pitch reduction | Yu-Sheng Chang, Chung-Ju Lee, Hai-Ching Chen, Hsiang-Huan Lee, Ming-Feng Shieh +5 more | 2018-07-03 |
| 9997404 | Method of forming an interconnect structure for a semiconductor device | Yung-Hsu Wu, Yu-Sheng Chang, Chia-Tien Wu, Chung-Ju Lee, Yung-Sung Yen +4 more | 2018-06-12 |
| 9911646 | Self-aligned double spacer patterning process | Yung-Hsu Wu, Tsung-Min Huang, Chung-Ju Lee, Tien-I Bao, Shau-Lin Shue | 2018-03-06 |
| 9888528 | Substrate support with multiple heating zones | Tomoharu Matsushita, Jallepally Ravi, Aravind Kamath, Xiaoxiong Yuan, Manjunatha Koppa | 2018-02-06 |
| 9865437 | High conductance process kit | Bonnie T. Chia | 2018-01-09 |