Issued Patents 2018
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163797 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Jung-Hsun Tsai, Kai-Fang Cheng, Hsin-Yen Huang, Tien-I Bao | 2018-12-25 |
| 10121698 | Method of manufacturing a semiconductor device | Hsiang-Huan Lee, Shau-Lin Shue, Kuang-Kuo Koai, Tung-Ching Tseng, Wen-Cheng Yang +3 more | 2018-11-06 |
| 10090245 | Semiconductor device structure | Kai-Fang Cheng, Chi-Lin Teng, Hsin-Yen Huang, Tien-I Bao, Jung-Hsun Tsai | 2018-10-02 |
| 10082626 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Ying-Hao Kuo, Kai-Fang Cheng, Tien-I Bao | 2018-09-25 |
| 10068770 | Method and structure for semiconductor device having gate spacer protection layer | Chih Wei Lu, Chung-Ju Lee, Chien-Hua Huang, Tien-I Bao | 2018-09-04 |
| 10014175 | Lithography using high selectivity spacers for pitch reduction | Yu-Sheng Chang, Cheng-Hsiung Tsai, Chung-Ju Lee, Hsiang-Huan Lee, Ming-Feng Shieh +5 more | 2018-07-03 |
| 10008382 | Semiconductor device having a porous low-k structure | Bo-Jiun Lin, Tien-I Bao | 2018-06-26 |
| 9941157 | Porogen bonded gap filling material in semiconductor manufacturing | Bo-Jiun Lin, Ching-Yu Chang, Tien-I Bao | 2018-04-10 |
| 9922927 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Jung-Hsun Tsai, Shau-Lin Shue, Tien-I Bao | 2018-03-20 |
| 9910217 | Method of fabrication polymer waveguide | Chun-Hao Tseng, Wan-Yu Lee, Tien-I Bao | 2018-03-06 |
| 9905457 | High boiling temperature solvent additives for semiconductor processing | Bo-Jiun Lin, Ching-Yu Chang, Tien-I Bao | 2018-02-27 |
| 9892946 | Processing apparatus and method | Kai-Fang Cheng, Shao-Kuan Lee | 2018-02-13 |
| 9881871 | Schemes for forming barrier layers for copper in interconnect structures | Chen-Hua Yu, Tien-I Bao | 2018-01-30 |
| 9859152 | Protecting layer in a semiconductor structure | Chi-Lin Teng, Tien-I Bao | 2018-01-02 |
| 9859154 | Structure and formation method of interconnect structure of semiconductor device | Shao-Kuan Lee, Hsin-Yen Huang | 2018-01-02 |