Issued Patents 2018
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10143383 | Attachable monitoring device | Shih-Chien Lin, Ho-Yi Chang, Kai-Chieh Chang | 2018-12-04 |
| 10137603 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2018-11-27 |
| 10135224 | Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die | Ying-Hao Kuo, Kuo-Chung Yee | 2018-11-20 |
| 10082626 | Adhesion promoter apparatus and method | Ying-Hao Kuo, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2018-09-25 |
| 9960099 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2018-05-01 |
| 9946306 | Electronic assembly and assemblying method | Chu-Chun Lo, Cheng-Min Lin | 2018-04-17 |
| 9910217 | Method of fabrication polymer waveguide | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2018-03-06 |
| 9902092 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2018-02-27 |
| 9865481 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2018-01-09 |
| 9859199 | Method for forming semiconductor package using carbon nano material in molding compound | Ying-Hao Kuo, Kuo-Chung Yee | 2018-01-02 |