Issued Patents 2018
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10161875 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2018-12-25 |
| 10157901 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Kuo-Chung Yee | 2018-12-18 |
| 10156741 | Electro-optic modulator device, optical device and method of making an optical device | Wan-Yu Lee | 2018-12-18 |
| 10137603 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Chun-Hao Tseng, Kuo-Chung Yee | 2018-11-27 |
| 10135224 | Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die | Chun-Hao Tseng, Kuo-Chung Yee | 2018-11-20 |
| 10082626 | Adhesion promoter apparatus and method | Chun-Hao Tseng, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2018-09-25 |
| 10061079 | Method of making a metal grating in a waveguide and device formed | Jui Hsieh Lai | 2018-08-28 |
| 9960099 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Kuo-Chung Yee | 2018-05-01 |
| 9902092 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Chun-Hao Tseng, Kuo-Chung Yee | 2018-02-27 |
| 9876127 | Backside-illuminated photodetector structure and method of making the same | Wan-Yu Lee | 2018-01-23 |
| 9865481 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Kuo-Chung Yee | 2018-01-09 |
| 9857309 | Bio-chip package with waveguide integrated spectrometer | Jui Hsieh Lai | 2018-01-02 |
| 9859199 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Kuo-Chung Yee | 2018-01-02 |