Issued Patents 2018
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163654 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu, Kuei-Shun Chen +4 more | 2018-12-25 |
| 10163887 | Method and structure for semiconductor mid-end-of-line (MEOL) process | Chih Wei Lu, Chien-Hua Huang, Hsiang-Ku Shen, Zhao-Cheng Chen | 2018-12-25 |
| 10068770 | Method and structure for semiconductor device having gate spacer protection layer | Chih Wei Lu, Hai-Ching Chen, Chien-Hua Huang, Tien-I Bao | 2018-09-04 |
| 10049919 | Semiconductor device including a target integrated circuit pattern | Chieh-Han Wu, Cheng-Hsiung Tsai, Ming-Feng Shieh, Ru-Gun Liu, Shau-Lin Shue +1 more | 2018-08-14 |
| 10049878 | Self-aligned patterning process | Tsung-Min Huang | 2018-08-14 |
| 10032640 | Formation of semiconductor structure with a photoresist cross link and de-cross link process | Chien-Hua Huang, Ming-Hui Weng, Tzu-Hui Wei | 2018-07-24 |
| 10020259 | Copper etching integration scheme | Chih Wei Lu, Hsiang-Huan Lee, Tien-I Bao | 2018-07-10 |
| 10014175 | Lithography using high selectivity spacers for pitch reduction | Yu-Sheng Chang, Cheng-Hsiung Tsai, Hai-Ching Chen, Hsiang-Huan Lee, Ming-Feng Shieh +5 more | 2018-07-03 |
| 9997404 | Method of forming an interconnect structure for a semiconductor device | Yung-Hsu Wu, Cheng-Hsiung Tsai, Yu-Sheng Chang, Chia-Tien Wu, Yung-Sung Yen +4 more | 2018-06-12 |
| 9947646 | Method and structure for semiconductor mid-end-of-line (MEOL) process | Chih Wei Lu, Chien-Hua Huang, Hsiang-Ku Shen, Zhao-Cheng Chen | 2018-04-17 |
| 9947535 | Trench formation using horn shaped spacer | Tsung-Min Huang, Yung-Hsu Wu | 2018-04-17 |
| 9934987 | Chemical circulation system and methods of cleaning chemicals | Chien-Hua Huang | 2018-04-03 |
| 9911646 | Self-aligned double spacer patterning process | Cheng-Hsiung Tsai, Yung-Hsu Wu, Tsung-Min Huang, Tien-I Bao, Shau-Lin Shue | 2018-03-06 |
| 9911623 | Via connection to a partially filled trench | Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Tien-I Bao +1 more | 2018-03-06 |
| 9857688 | Method of forming fine patterns | Chih Wei Lu, Tien-I Bao | 2018-01-02 |