Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10008382 | Semiconductor device having a porous low-k structure | Hai-Ching Chen, Tien-I Bao | 2018-06-26 |
| 9941157 | Porogen bonded gap filling material in semiconductor manufacturing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2018-04-10 |
| 9905457 | High boiling temperature solvent additives for semiconductor processing | Ching-Yu Chang, Hai-Ching Chen, Tien-I Bao | 2018-02-27 |