Issued Patents 2018
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062728 | Image sensor device and method | Jeng-Shyan Lin, Feng-Chi Hung, Jen-Cheng Liu, Shuang-Ji Tsai | 2018-08-28 |
| 10056353 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Jen-Cheng Liu, Chun-Chieh Chuang, Chia-Chieh Lin, U-Ting Chen | 2018-08-21 |
| 10049981 | Through via structure, semiconductor device and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu | 2018-08-14 |
| 10038026 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2018-07-31 |
| 10038025 | Via support structure under pad areas for BSI bondability improvement | Sin-Yao Huang, Ching-Chun Wang, Feng-Chi Hung | 2018-07-31 |
| 10014340 | Stacked SPAD image sensor | Ming-Hsien Yang, Ching-Chun Wang, Feng-Chi Hung, Shyh-Fann Ting, Chun-Yuan Chen | 2018-07-03 |
| 10008532 | Implant isolated devices and method for forming the same | Min-Feng Kao, Jen-Cheng Liu, Tzu-Hsuan Hsu, Wen-De Wang, Wen-I Hsu | 2018-06-26 |
| 9978805 | Method for manufacturing image sensor structure having wide contact | Tzu-Jui Wang, Jen-Cheng Liu, Tzu-Hsuan Hsu, Yuichiro Yamashita | 2018-05-22 |
| 9966412 | Method for reducing optical cross-talk in image sensors | Chin-Min Lin, Ching-Chun Wang, Chun-Ming Su, Tzu-Hsuan Hsu | 2018-05-08 |
| 9966405 | Method and apparatus for image sensor packaging | Tzu-Hsuan Hsu | 2018-05-08 |
| 9960142 | Hybrid bonding with air-gap structure | Szu-Ying Chen | 2018-05-01 |
| 9954022 | Extra doped region for back-side deep trench isolation | Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2018-04-24 |
| 9941249 | Multi-wafer stacking by Ox-Ox bonding | Shu-Ting Tsai, Szu-Ying Chen, Jeng-Shyan Lin, Tzu-Hsuan Hsu, Feng-Chi Hung | 2018-04-10 |
| 9935147 | Deep trench isolation structure in image sensor device | Hsin-Hung Chen, Jen-Cheng Liu, Alexander Kalnitsky, Wen-De Wang | 2018-04-03 |
| 9923011 | Semiconductor device structure with stacked semiconductor dies | Min-Feng Kao, Jen-Cheng Liu, Hsun-Ying Huang | 2018-03-20 |
| 9917123 | Method and apparatus for image sensor packaging | Szu-Ying Chen, Tzu-Jui Wang, Jen-Cheng Liu | 2018-03-13 |
| 9905426 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Jen-Cheng Liu, Tzu-Hsuan Hsu, Feng-Chi Hung | 2018-02-27 |
| 9905605 | Phase detection autofocus techniques | Wen-I Hsu, Feng-Chi Hung, Keng-Yu Chou | 2018-02-27 |
| 9893111 | Full-PDAF (phase detection autofocus) CMOS image sensor structures | Keng-Yu Chou, Chun-Hao Chuang, Chien-Hsien Tseng, Wei-Chieh Chiang | 2018-02-13 |
| 9887234 | CMOS image sensor and method for forming the same | Min-Feng Kao, Wei-Cheng Hsu, Tzu-Jui Wang, Hsiao-Hui Tseng, Tzu-Hsuan Hsu +2 more | 2018-02-06 |
| 9887182 | 3DIC structure and method for hybrid bonding semiconductor wafers | Ju-Shi Chen, Cheng-Ying Ho, Chun-Chieh Chuang, Sheng-Chau Chen, Shih Pei Chou +4 more | 2018-02-06 |
| 9881884 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Feng-Chi Hung, Sin-Yao Huang | 2018-01-30 |
| 9875989 | Semiconductor device structure | Min-Feng Kao, Jen-Cheng Liu, Jeng-Shyan Lin, Hsun-Ying Huang | 2018-01-23 |
| 9865645 | Interconnect structure for stacked device and method | Chun-Chieh Chuang, Jen-Cheng Liu, Feng-Chi Hung, Tzu-Hsuan Hsu, Shu-Ting Tsai +1 more | 2018-01-09 |
| 9865630 | Image sensor pickup region layout | Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu | 2018-01-09 |