Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074680 | Image sensor with low step height between back-side metal and pixel array | Chien-Hsien Tseng, Nai-Wen Cheng, Shou-Gwo Wuu, Tung-Ting Wu | 2018-09-11 |
| 10038026 | Bond pad structure for bonding improvement | Sin-Yao Huang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Shih Pei Chou | 2018-07-31 |