Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10038025 | Via support structure under pad areas for BSI bondability improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2018-07-31 |
| 10038026 | Bond pad structure for bonding improvement | Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Ming-Tsong Wang, Shih Pei Chou | 2018-07-31 |
| 9881884 | Semiconductor device structure and method for forming the same | Ming-Hsien Yang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung | 2018-01-30 |