Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155369 | Wafer debonding system and method | Chang-Chen Tsao, Kuo-Liang Lu, Ru-Liang Lee, Yu-Hung Cheng, Yeur-Luen Tu +1 more | 2018-12-18 |
| 10018573 | Dual-function wafer handling apparatus | Ming-Han Tsai, Guan-Cyun Li, Yen-Ju Wei, Chiung-Min Lin, Yi-Ming Chen | 2018-07-10 |