WS

Wen-Lin Shih

TSMC: 1 patents #1,476 of 2,904Top 55%
📍 Baoshan, TW: #127 of 381 inventorsTop 35%
Overall (2018): #196,339 of 503,207Top 40%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10068868 Multi-strike process for bonding packages and the packages thereof Tung-Liang Shao, Chih-Hang Tung, Hsiao-Yun Chen, Chen-Hua Yu 2018-09-04