Issued Patents 2018
Showing 1–25 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163711 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung | 2018-12-25 |
| 10163875 | Method for forming chip package structure with adhesive layer | Li-Hui Cheng, Po-Hao Tsai, Yi-Hang Lin | 2018-12-25 |
| 10163817 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Chen-Hua Yu, Szu-Wei Lu, Yen-Yao Chi | 2018-12-25 |
| 10163841 | Multi-chip package and method of formation | Chen-Hua Yu, Jui-Pin Hung, Der-Chyang Yeh | 2018-12-25 |
| 10163706 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Wen-Chih Chiou, Shin-Puu Jeng | 2018-12-25 |
| 10163848 | Semiconductor package | Li-Hui Cheng, Po-Hao Tsai, Chih-Chien Pan | 2018-12-25 |
| 10163813 | Chip package structure including redistribution structure and conductive shielding film | Po-Hao Tsai | 2018-12-25 |
| 10163857 | Multi-chip fan out package and methods of forming the same | Chen-Hua Yu, Jui-Pin Hung | 2018-12-25 |
| 10163872 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Po-Hao Tsai | 2018-12-25 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10157850 | Semiconductor packages and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2018-12-18 |
| 10157888 | Integrated fan-out packages and methods of forming the same | Tsung-Fu Tsai, Chen-Hua Yu, Po-Hao Tsai, Shih-Ting Lin, Szu-Wei Lu +2 more | 2018-12-18 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee +2 more | 2018-12-18 |
| 10153179 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Shih-Ting Lin, Chen-Hua Yu | 2018-12-11 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Szu-Wei Lu, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2018-12-11 |
| 10153175 | Metal oxide layered structure and methods of forming the same | Cheng-Lin Huang | 2018-12-11 |
| 10147816 | Semiconductor structure and fabrication method thereof | — | 2018-12-04 |
| 10141239 | Thermal dissipation through seal rings in 3DIC structure | — | 2018-11-27 |
| 10141253 | Semiconductor device and method | Chi-Hsi Wu, Chen-Hua Yu, Po-Hao Tsai | 2018-11-27 |
| 10134719 | Semiconductor package and manufacturing method thereof | Li-Hui Cheng, Po-Hao Tsai | 2018-11-20 |
| 10134701 | Solder bump for ball grid array | Jung-Hua Chang, Cheng-Lin Huang | 2018-11-20 |
| 10128140 | System and method for automatically correcting for rotational misalignment of wafers on film frames | — | 2018-11-13 |
| 10128175 | Packaging methods and packaged semiconductor devices | Jui-Pin Hung | 2018-11-13 |
| 10128226 | Mechanisms for forming package structure | Po-Hao Tsai | 2018-11-13 |
| 10115675 | Packaged semiconductor device and method of fabricating a packaged semiconductor device | Li-Hui Cheng, Po-Hao Tsai | 2018-10-30 |