Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157888 | Integrated fan-out packages and methods of forming the same | Jing-Cheng Lin, Tsung-Fu Tsai, Chen-Hua Yu, Po-Hao Tsai, Szu-Wei Lu +2 more | 2018-12-18 |
| 10153179 | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking | Jing-Cheng Lin, Chen-Hua Yu | 2018-12-11 |