Issued Patents 2018
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163817 | Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same | Jing-Cheng Lin, Chen-Hua Yu, Yen-Yao Chi | 2018-12-25 |
| 10157888 | Integrated fan-out packages and methods of forming the same | Jing-Cheng Lin, Tsung-Fu Tsai, Chen-Hua Yu, Po-Hao Tsai, Shih-Ting Lin +2 more | 2018-12-18 |
| 10157879 | Die-to-die gap control for semiconductor structure and method | Jing-Cheng Lin, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee +2 more | 2018-12-18 |
| 10157870 | Integrated fan-out package and method of fabricating the same | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2018-12-18 |
| 10157850 | Semiconductor packages and manufacturing method thereof | Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2018-12-18 |
| 10153222 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Shang-Yun Hou, Wen-Hsin Wei +2 more | 2018-12-11 |
| 10115650 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Jing-Cheng Lin | 2018-10-30 |
| 10090253 | Semiconductor package | Jing-Cheng Lin, Po-Hao Tsai, Ying-Ching Shih | 2018-10-02 |
| 10032662 | Packaged semiconductor devices and packaging methods thereof | Shu-Hang Liao, Ying-Ching Shih, Jing-Cheng Lin | 2018-07-24 |
| 9947629 | Method of forming contact holes in a fan out package | Feng-Cheng Hsu, Jing-Cheng Lin | 2018-04-17 |
| 9929109 | Stacking of multiple dies for forming three dimensional integrated circuit (3DIC) structure | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin | 2018-03-27 |
| 9895871 | De-bonding and cleaning process and system | Ying-Ching Shih, Jing-Cheng Lin | 2018-02-20 |
| 9859181 | Underfill dispensing in 3D IC using metrology | Jing-Cheng Lin, I-Hsuan Peng | 2018-01-02 |