Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079192 | Semiconductor chip package assembly with improved heat dissipation performance | Ching-Wen Hsiao, Tzu-Hung Lin, Tung-Hsien Hsieh, Sheng-Ming Chang | 2018-09-18 |
| 10032756 | Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same | Tzu-Hung Lin, Ching-Wen Hsiao | 2018-07-24 |
| 9997498 | Semiconductor package assembly | Tzu-Hung Lin, Ching-Wen Hsiao | 2018-06-12 |
| 9978729 | Semiconductor package assembly | Tzu-Hung Lin | 2018-05-22 |
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Chi-Chin Lien, Nai-Wei Liu, Ching-Wen Hsiao, Wei-Che Huang | 2018-04-10 |
| 9859181 | Underfill dispensing in 3D IC using metrology | Jing-Cheng Lin, Szu-Wei Lu | 2018-01-02 |