Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147674 | Semiconductor package assembly | Che-Ya Chou | 2018-12-04 |
| 10079192 | Semiconductor chip package assembly with improved heat dissipation performance | Ching-Wen Hsiao, Tzu-Hung Lin, I-Hsuan Peng, Sheng-Ming Chang | 2018-09-18 |