Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163873 | Package-on-package (PoP) device with integrated passive device in a via | Chen-Shien Chen | 2018-12-25 |
| 10134706 | Warpage control of semiconductor die package | Kuo Lung Pan, Chen-Shien Chen | 2018-11-20 |
| 10079192 | Semiconductor chip package assembly with improved heat dissipation performance | Tzu-Hung Lin, I-Hsuan Peng, Tung-Hsien Hsieh, Sheng-Ming Chang | 2018-09-18 |
| 10032756 | Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same | Tzu-Hung Lin, I-Hsuan Peng | 2018-07-24 |
| 10008479 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2018-06-26 |
| 9997498 | Semiconductor package assembly | Tzu-Hung Lin, I-Hsuan Peng | 2018-06-12 |
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Chi-Chin Lien, Nai-Wei Liu, I-Hsuan Peng, Wei-Che Huang | 2018-04-10 |
| 9911725 | Packaging mechanisms for dies with different sizes of connectors | Chih-Hua Chen, Chen-Shien Chen | 2018-03-06 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Tsung-Ding Wang, Ming Hung Tseng, Chen-Shien Chen | 2018-01-02 |