Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109608 | Semiconductor package | Wen-Sung Hsu, Tai-Yu Chen | 2018-10-23 |
| 10109566 | Semiconductor package | Jia-Wei Fang | 2018-10-23 |
| 10090375 | Semiconductor structure | Cheng-Chou Hung | 2018-10-02 |
| 10089805 | Method for householder of mansion to manage entrance by smart phone | Shaw Hwa Hwang, Bing Chih YAO, Kuan-Lin Chen, Yao Hsing CHUNG, Chi Jung HUANG +5 more | 2018-10-02 |
| 10079192 | Semiconductor chip package assembly with improved heat dissipation performance | Ching-Wen Hsiao, I-Hsuan Peng, Tung-Hsien Hsieh, Sheng-Ming Chang | 2018-09-18 |
| 10032756 | Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same | Ching-Wen Hsiao, I-Hsuan Peng | 2018-07-24 |
| 9997498 | Semiconductor package assembly | Ching-Wen Hsiao, I-Hsuan Peng | 2018-06-12 |
| 9978729 | Semiconductor package assembly | I-Hsuan Peng | 2018-05-22 |
| 9947624 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Wei-Che Huang, Yu-Hua Huang, Kuei-Ti Chan +2 more | 2018-04-17 |
| 9941260 | Fan-out package structure having embedded package substrate | Chi-Chin Lien, Nai-Wei Liu, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2018-04-10 |
| 9899261 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Wei-Che Huang, Yu-Hua Huang | 2018-02-20 |