Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947624 | Semiconductor package assembly with through silicon via interconnect | Ming-Tzong Yang, Cheng-Chou Hung, Yu-Hua Huang, Tzu-Hung Lin, Kuei-Ti Chan +2 more | 2018-04-17 |
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Chi-Chin Lien, Nai-Wei Liu, I-Hsuan Peng, Ching-Wen Hsiao | 2018-04-10 |
| 9899261 | Semiconductor package structure and method for forming the same | Cheng-Chou Hung, Ming-Tzong Yang, Tung-Hsing Lee, Yu-Hua Huang, Tzu-Hung Lin | 2018-02-20 |
| 9870980 | Semiconductor package with through silicon via interconnect | Ming-Tzong Yang, Yu-Hua Huang | 2018-01-16 |