Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Nai-Wei Liu, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2018-04-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Nai-Wei Liu, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2018-04-10 |