Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083913 | Fan-out POP structure with inconsecutive polymer layer | Yi-Lin Tsai, Jeffrey Chang, Jing-Cheng Lin, Tsei-Chung Fu | 2018-09-25 |
| 9978657 | Semiconductor package device and manufacturing method thereof | Jui-Pin Hung, Jing-Cheng Lin | 2018-05-22 |
| 9953907 | PoP device | Chin-Chuan Chang, Jing-Cheng Lin, Wan-Ting Shih | 2018-04-24 |
| 9941260 | Fan-out package structure having embedded package substrate | Tzu-Hung Lin, Chi-Chin Lien, I-Hsuan Peng, Ching-Wen Hsiao, Wei-Che Huang | 2018-04-10 |