TF

Tsei-Chung Fu

TSMC: 2 patents #985 of 2,904Top 35%
📍 Toufen, TW: #1 of 16 inventorsTop 7%
Overall (2018): #93,739 of 503,207Top 20%
2
Patents 2018

Issued Patents 2018

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10083913 Fan-out POP structure with inconsecutive polymer layer Yi-Lin Tsai, Jeffrey Chang, Jing-Cheng Lin, Nai-Wei Liu 2018-09-25
9941244 Protective layer for contact pads in fan-out interconnect structure and method of forming same Chin-Chuan Chang, Jing-Cheng Lin 2018-04-10