Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115604 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2018-10-30 |
| 10109608 | Semiconductor package | Tzu-Hung Lin, Tai-Yu Chen | 2018-10-23 |
| 10074581 | Chip package having a patterned conducting plate and a conducting pad with a recess | Ming-Chieh Lin, Ta-Jen Yu | 2018-09-11 |
| 9922844 | Semiconductor package and method for fabricating base for semiconductor package | Ta-Jen Yu | 2018-03-20 |
| 9908203 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Tao Cheng, Shih-Chin Lin | 2018-03-06 |
| 9881902 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Shih-Chin Lin, Tao Cheng | 2018-01-30 |