Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115604 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2018-10-30 |
| 10074581 | Chip package having a patterned conducting plate and a conducting pad with a recess | Wen-Sung Hsu, Ming-Chieh Lin | 2018-09-11 |
| 9972593 | Semiconductor package | Ching-Liou Huang | 2018-05-15 |
| 9922844 | Semiconductor package and method for fabricating base for semiconductor package | Wen-Sung Hsu | 2018-03-20 |