Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074581 | Chip package having a patterned conducting plate and a conducting pad with a recess | Wen-Sung Hsu, Ta-Jen Yu | 2018-09-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074581 | Chip package having a patterned conducting plate and a conducting pad with a recess | Wen-Sung Hsu, Ta-Jen Yu | 2018-09-11 |