Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002833 | Power and ground routing of integrated circuit devices with improved IR drop and chip performance | Ching-Chung Ko, Tien-Yueh Liu, Ta-Hsi Chou, Peng-Cheng Kao, Ling-Wei Ke | 2018-06-19 |
| 9908203 | Composite solder ball, semiconductor package using the same, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2018-03-06 |
| 9905515 | Integrated circuit stress releasing structure | Chin-Chiang Chang | 2018-02-27 |
| 9881902 | Semiconductor package, semiconductor device using the same and manufacturing method thereof | Wen-Sung Hsu, Shih-Chin Lin | 2018-01-30 |