Issued Patents 2018
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163877 | System in package process flow | Chien-Hsiun Lee | 2018-12-25 |
| 10163710 | Method of manufacturing semiconductor device by applying molding layer in substrate groove | Jung Wei Cheng, Bo-I Lee | 2018-12-25 |
| 10128208 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Jung Wei Cheng, Yu-Min Liang | 2018-11-13 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Hung-Jen Lin, Jung Wei Cheng | 2018-09-11 |
| 10056267 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Mirng-Ji Lii, Chien-Hsun Lee, Chen-Hua Yu | 2018-08-21 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jung Wei Cheng, Ming-Che Liu +2 more | 2018-07-17 |
| 10020236 | Dam for three-dimensional integrated circuit | An-Jhih Su, Chien Ling Hwang, Jung Wei Cheng, Hsin-Yu Pan, Chen-Hua Yu | 2018-07-10 |
| 9997480 | Method of forming a semiconductor device including strain reduced structure | Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Yu-Feng Chen | 2018-06-12 |
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Jiun Yi Wu, Ming-Chung Sung | 2018-05-29 |
| 9935090 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Jung Wei Cheng, Chien-Hsun Lee | 2018-04-03 |
| 9935038 | Semiconductor device packages and methods | Hung-Jen Lin, Jiun Yi Wu, Mirng-Ji Lii, Chien-Hsun Lee | 2018-04-03 |
| 9929115 | Device with optimized thermal characteristics | Hao-Cheng Hou, Jung Wei Cheng, Ming-Che Liu | 2018-03-27 |
| 9917068 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Jung Wei Cheng, Yu-Min Liang | 2018-03-13 |
| 9881898 | System in package process flow | Chien-Hsun Lee | 2018-01-30 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan, Han-Ping Pu | 2018-01-02 |
| 9859267 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Hung-Jen Lin | 2018-01-02 |
| 9859252 | Cooling channels in 3DIC stacks | Kai-Ming Ching, Ching-Wen Hsiao, Ming Hung Tseng, Chen-Shien Chen | 2018-01-02 |