Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang +2 more | 2018-12-25 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang | 2018-09-11 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng +2 more | 2018-07-17 |
| 9935038 | Semiconductor device packages and methods | Tsung-Ding Wang, Jiun Yi Wu, Mirng-Ji Lii, Chien-Hsun Lee | 2018-04-03 |
| 9859267 | Package structures and methods of forming the same | Hao-Cheng Hou, Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang | 2018-01-02 |