Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10141201 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chi-Yang Yu, Jung Wei Cheng, Chin-Liang Chen | 2018-11-27 |
| 10090345 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Yung Ching Chen, Mirng-Ji Lii | 2018-10-02 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang | 2018-09-11 |
| 10056267 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Mirng-Ji Lii, Chen-Hua Yu | 2018-08-21 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Tsung-Ding Wang, Jung Wei Cheng, Ming-Che Liu +2 more | 2018-07-17 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Yung Ching Chen, Chen-Hua Yu, Jiun Yi Wu, Ming-Da Cheng, Mirng-Ji Lii | 2018-07-10 |
| 9985013 | Package-on-package structure and methods for forming the same | Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu, Ming-Chung Sung | 2018-05-29 |
| 9984999 | Packages with stacked dies and methods of forming the same | Dean Wang, Mirng-Ji Lii, Chen-Hua Yu | 2018-05-29 |
| 9935090 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Jung Wei Cheng, Tsung-Ding Wang | 2018-04-03 |
| 9935038 | Semiconductor device packages and methods | Tsung-Ding Wang, Hung-Jen Lin, Jiun Yi Wu, Mirng-Ji Lii | 2018-04-03 |
| 9881898 | System in package process flow | Tsung-Ding Wang | 2018-01-30 |
| 9870946 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Jiun Yi Wu | 2018-01-16 |