Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Jiun Yi Wu | 2018-05-29 |
MS
Ming-Chung Sung
Overall (2018): #299,241 of 503,207Top 60%
1
Patents 2018