Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128208 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Yu-Feng Chen, Jung Wei Cheng, Yu-Min Liang, Tsung-Ding Wang | 2018-11-13 |
| 10074604 | Integrated fan-out package and method of fabricating the same | Chien-Hsun Lee, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang | 2018-09-11 |
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng +2 more | 2018-07-17 |
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Jiun Yi Wu, Ming-Chung Sung | 2018-05-29 |
| 9929115 | Device with optimized thermal characteristics | Jung Wei Cheng, Tsung-Ding Wang, Ming-Che Liu | 2018-03-27 |
| 9917068 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Yu-Feng Chen, Jung Wei Cheng, Yu-Min Liang, Tsung-Ding Wang | 2018-03-13 |
| 9859267 | Package structures and methods of forming the same | Ming-Che Liu, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang, Hung-Jen Lin | 2018-01-02 |