Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10026671 | Substrate design for semiconductor packages and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Tsung-Ding Wang, Jung Wei Cheng +2 more | 2018-07-17 |
| 9929115 | Device with optimized thermal characteristics | Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang | 2018-03-27 |
| 9859267 | Package structures and methods of forming the same | Hao-Cheng Hou, Chun-Chih Chuang, Jung Wei Cheng, Tsung-Ding Wang, Hung-Jen Lin | 2018-01-02 |