Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163774 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2018-12-25 |
| 10163768 | Semiconductor structure and method of manufacturing the same | Jiun Yi Wu | 2018-12-25 |
| 10157871 | Integrated fan-out package and manufacturing method thereof | Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho | 2018-12-18 |
| 10141281 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chen-Shien Chen, Chung-Shi Liu | 2018-11-27 |
| 10128195 | Substrate design with balanced metal and solder resist density | Yu-Wei Lin, Guan-Yu Chen, Tin-Hao Kuo, Chen-Shien Chen | 2018-11-13 |
| 10128208 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Jung Wei Cheng, Tsung-Ding Wang | 2018-11-13 |
| 10049894 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Ming-Che Ho, Hung-Jui Kuo, Chung-Shi Liu +1 more | 2018-08-14 |
| 10020276 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Yu-Wei Lin, Tin-Hao Kuo, Chun-Hung Lin | 2018-07-10 |
| 10014270 | Protrusion bump pads for bond-on-trace processing | Jiun Yi Wu | 2018-07-03 |
| 9941186 | Method for manufacturing semiconductor structure | Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho | 2018-04-10 |
| 9917068 | Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices | Hao-Cheng Hou, Yu-Feng Chen, Jung Wei Cheng, Tsung-Ding Wang | 2018-03-13 |
| 9865566 | Semiconductor structure and manufacturing method thereof | Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen | 2018-01-09 |