Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163734 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2018-12-25 |
| 10126644 | Pellicle for advanced lithography | Yu-Ching Lee, Ching-Fang Yu, Ting-Hao Hsu, Ching-Hsiang Chang, Sheng-Chi Chin | 2018-11-13 |
| 10048015 | Liquid-vapor separating type heat conductive structure | — | 2018-08-14 |
| 10020276 | Protrusion bump pads for bond-on-trace processing | Chen-Shien Chen, Yu-Feng Chen, Yu-Wei Lin, Tin-Hao Kuo, Yu-Min Liang | 2018-07-10 |
| 10018427 | Vapor chamber structure | — | 2018-07-10 |
| 10012445 | Vapor chamber and heat pipe combined structure | — | 2018-07-03 |
| 9978715 | Semiconductor package structure and semiconductor process | Shih-Ming Huang, Yi-Ting Chen, Wen-Hsin Lin, Shih-Wei Chan, Yung-Hsing CHANG | 2018-05-22 |
| 9933699 | Pellicle aging estimation and particle removal from pellicle via acoustic waves | Yu-Ching Lee, Ching-Fang Yu, Sheng-Chi Chin, Ting-Hao Hsu, Mark Chang | 2018-04-03 |