Issued Patents 2018
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163804 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-12-25 |
| 10163734 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2018-12-25 |
| 10157849 | Packages with molding structures and methods of forming the same | Cheng-Tar Wu, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2018-12-18 |
| 10134717 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chung-Shi Liu, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2018-11-20 |
| 10050000 | Bump-on-trace structures with high assembly yield | Chen-Shien Chen, Chung-Shi Liu, Ming-Da Cheng, Tin-Hao Kuo, Yi-Teh Chou | 2018-08-14 |
| 10043778 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng | 2018-08-07 |
| 10020211 | Wafer-level molding chase design | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Ming-Da Cheng, Meng-Tse Chen +2 more | 2018-07-10 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9887162 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-02-06 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-01-16 |