Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163774 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2018-12-25 |
| 10163768 | Semiconductor structure and method of manufacturing the same | Yu-Min Liang | 2018-12-25 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Yung Ching Chen, Chien-Hsun Lee, Chen-Hua Yu, Ming-Da Cheng, Mirng-Ji Lii | 2018-07-10 |
| 10014270 | Protrusion bump pads for bond-on-trace processing | Yu-Min Liang | 2018-07-03 |
| 9991246 | Contoured package-on-package joint | — | 2018-06-05 |
| 9985013 | Package-on-package structure and methods for forming the same | Chien-Hsun Lee, Jung Wei Cheng, Hao-Cheng Hou, Tsung-Ding Wang, Ming-Chung Sung | 2018-05-29 |
| 9935038 | Semiconductor device packages and methods | Tsung-Ding Wang, Hung-Jen Lin, Mirng-Ji Lii, Chien-Hsun Lee | 2018-04-03 |
| 9870946 | Wafer level package structure and method of forming same | Chen-Hua Yu, Kuo-Chung Yee, Mirng-Ji Lii, Chien-Hsun Lee | 2018-01-16 |
| 9865580 | Package on-package with cavity in interposer | — | 2018-01-09 |