Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090345 | Interconnect structure for CIS flip-chip bonding and methods for forming the same | Chen-Hua Yu, Chien-Hsun Lee, Mirng-Ji Lii | 2018-10-02 |
| 10020286 | Package on package devices and methods of packaging semiconductor dies | Chien-Hsun Lee, Chen-Hua Yu, Jiun Yi Wu, Ming-Da Cheng, Mirng-Ji Lii | 2018-07-10 |