Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157863 | Method for forming a lid structure for a semiconductor device package | Kuan-Lin Ho, Chin-Liang Chen, Yu-Chih Liu | 2018-12-18 |
| 10157871 | Integrated fan-out package and manufacturing method thereof | Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang | 2018-12-18 |
| 10141201 | Integrated circuit packages and methods of forming same | Chen-Hua Yu, Chien-Hsun Lee, Jung Wei Cheng, Chin-Liang Chen | 2018-11-27 |
| 9941186 | Method for manufacturing semiconductor structure | Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang | 2018-04-10 |
| 9865566 | Semiconductor structure and manufacturing method thereof | Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang | 2018-01-09 |