Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163877 | System in package process flow | Tsung-Ding Wang | 2018-12-25 |
| 9905520 | Solder ball protection structure with thick polymer layer | Chen-Hua Yu, Lawrence Chiang Sheu, Hao-Yi Tsai | 2018-02-27 |