Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147674 | Semiconductor package assembly | Tung-Hsien Hsieh | 2018-12-04 |
| 10128192 | Fan-out package structure | Min-Chen Lin, Nan-Cheng Chen | 2018-11-13 |
| 10103128 | Semiconductor package incorporating redistribution layer interposer | Kun-Ting Hung, Chia-Hao Yang, Nan-Cheng Chen | 2018-10-16 |
| 10074628 | System-in-package and fabrication method thereof | Hsing-Chih Liu | 2018-09-11 |