Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103128 | Semiconductor package incorporating redistribution layer interposer | Che-Ya Chou, Kun-Ting Hung, Nan-Cheng Chen | 2018-10-16 |
| 9991227 | Bonding pad arrangement design for multi-die semiconductor package structure | Hsing-Chih Liu, Ying-Chih Chen | 2018-06-05 |