Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074628 | System-in-package and fabrication method thereof | Che-Ya Chou | 2018-09-11 |
| 9991227 | Bonding pad arrangement design for multi-die semiconductor package structure | Chia-Hao Yang, Ying-Chih Chen | 2018-06-05 |