Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128192 | Fan-out package structure | Min-Chen Lin, Che-Ya Chou | 2018-11-13 |
| 10103128 | Semiconductor package incorporating redistribution layer interposer | Che-Ya Chou, Kun-Ting Hung, Chia-Hao Yang | 2018-10-16 |